Review on PCM Heat Sink for Electronic Thermal Management Application

Abstract

A significant challenge in thermal management has arisen as a result of the rising demand for high-performance electronic devices. The efficiency, size, and weight of conventional cooling methods like liquid and air cooling are constrained. Due to their high storage of latent heat capacity and isothermal phase transition behavior, phase change materials (PCMs) have become a promising thermal management solution. The purpose of this experimental study is to evaluate the performance of a PCM heat sink for electronic thermal regulation. The PCM heat sink is made up of a PCM module attached to a typical heat sink. To improve heat dissipation capabilities, the PCM module uses a PCM material with a suitable phase change temperature and encapsulation. The experimental setup involves simulating real-world operating conditions by applying controlled heat loads to electronic components. By observing temperature changes, thermal resistance, and transient response, the PCM heat sink’s thermal performance is assessed. To evaluate the superiority of the PCM heat sink, a comparison is made with traditional air-cooled and liquid-cooled heat sink configurations. The experimental investigation’s findings show that the PCM heat sink performs better in terms of thermal management than traditional cooling techniques. The phase change process used by the PCM efficiently absorbs and stores extra heat produced by electronic parts, improving temperature regulation and lowering temperature gradients. Lower component temperatures and higher operational reliability are the results of the PCM heat sink’s improved thermal resistance and heat dissipation efficiency. A further benefit of the PCM heat sink’s isothermal behavior during the phase transition is that it prevents temperature spikes and lessens the effects of heat stress on the electronic devices. The long cooling times provided by the PCM material’s high latent heat storage capacity allow for prolonged operation without affecting device performance. This experimental study concludes by demonstrating the efficiency of a PCM heat sink for electronic thermal management. The design of heat sinks with PCM integration offers notable enhancements in temperature control, thermal resistance, and system overall reliability. The results of this research help to advance thermal management strategies, which makes it easier to create efficient electronic devices with better cooling capacities.